JPH04744U - - Google Patents
Info
- Publication number
- JPH04744U JPH04744U JP1990038982U JP3898290U JPH04744U JP H04744 U JPH04744 U JP H04744U JP 1990038982 U JP1990038982 U JP 1990038982U JP 3898290 U JP3898290 U JP 3898290U JP H04744 U JPH04744 U JP H04744U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- upper mold
- fluid
- elastic body
- relief
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990038982U JPH04744U (en]) | 1990-04-13 | 1990-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990038982U JPH04744U (en]) | 1990-04-13 | 1990-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04744U true JPH04744U (en]) | 1992-01-07 |
Family
ID=31547474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990038982U Pending JPH04744U (en]) | 1990-04-13 | 1990-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04744U (en]) |
-
1990
- 1990-04-13 JP JP1990038982U patent/JPH04744U/ja active Pending
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